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How to update IFX TPM 1.2 to TPM 2.0 on HP Z420 Workstation

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HP Z420
Microsoft Windows 10 (64-bit)

This question was asked back in 2019 for other purposes. Since windows 10 did not require a TPM module to function, nor upgrade from v1.2 -> v2.0, the question was never actually resolved.


Windows 11 is announced that it requires a TPM 2.0 module.

All hardware of the z420 checked out good, except the TPM module.


I need a update to update the BIOS so the module gets its upgrade. Any ideas?

Manufacturer : IPX

Version 3.19

Specification 1.2

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In the HP workstations the Infineon chips are soldered in.  There is an updater for the specific newer1.2 chip in the ZX40 workstations to upgrade that chip from 1.2 to 2.0.


There is no updater like that for the specific earlier chip in the ZX20 generation workstations.  The hope related to W11 is that MS would drop their requirement for W11 to having a 1.2 chip.  Don't forget the more advanced processor requirement by MS.  Don't hold your breath.  However, you may have another requirement than W11 prompting your question.


Your hope for a 1.2 to 2.0 updater for the older chip in the ZX20 workstations should be directed to HP and Infineon.  I doubt it will ever be created, however.

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i spent a few min on this question and the SLB9635 used in these workstations may be pin compatible with it's replacement chip the SLB9650/9665 as i believe the chip pinouts are the same, however direct chip replacement is not a beginners task it requires a hot air station and the requisite skills to use  said device


in other words you will need to pay some repair shop to do this for you, and there's no guarantee it will work


personally, i'm happy to wait till win 11 is released and then see what i want to do (i'll possibly just replace the system)

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If the pin configuration is the same and the chip is reasonably easy to gain access to, an easy way to replace it without having to use hot air is with a *very* fine (!) cutter: Each leg is cut off closest to the body. The body can then be lifted off leaving the cut pins on the solder pads. Then, with a fine tip solder station, the individual pins can be unsoldered/removed from the main board. I have done this with other fine pitch SO-packages but it requires outmost patience (and no coffee before the attempt). It must be understood that if there are any vias on the PCB close to the pins, the heat transfer to an underlaying ground plane could be considerable which will present a risk for the unsoldering/resoldering process being succesful. When placing the new chip, it should be fixed in position by first soldering the two pins furtherest away from one another. This procedure should be used with very fine 60/40 tin/lead solder. The modern unleaded is a dread to use...


And: ESD protection is of course mandatory...

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