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HP Recommended

Hello, please tell me what thermal pads are used on this laptop from the factory. Where can I find out their thickness, and where should I use them?

1 ACCEPTED SOLUTION

Accepted Solutions
HP Recommended

@SigHt1219, Thank you for your response. 

Using liquid metal or phase change thermal pads (like Fujipoly or Honeywell PCM) can significantly improve thermal conductivity, especially for VRMs and memory modules. 
Just keep in mind:

  • Liquid metal should only be used on bare metal surfaces (like CPU/GPU dies) and never on components with exposed electrical contacts (e.g., SMD capacitors or VRMs), unless you're insulating surrounding areas.
  • Phase change pads are great for consistent pressure zones and can outperform standard silicone pads in many cases.

If you're unsure about pad thickness:

  1. Use soft clay or modeling putty between the heatsink and component.
  2. Assemble the laptop and disassemble again.
  3. Measure the compressed clay with a caliper to estimate the gap.

I hope this helps!

 

If my response resolves your issue, please click “Accepted Solution” to help others find the answer. Also, don’t forget to click the “Yes” button to say thanks!

 

Take care and have a great day.

 

Max3Aj

HP Support

View solution in original post

7 REPLIES 7
HP Recommended

@SigHt1219, Welcome to the HP Support Community – it’s great to have you here!

I appreciate you taking the time to share your question. I'm more than happy to assist with this and provide a solution that works for you.

You're asking a great question, understanding the correct thermal interface materials is crucial for maintaining optimal cooling performance in your HP OMEN 16-xf0000.

Factory Thermal Interface Materials Used

According to the Maintenance and Service Guide for OMEN 16 series laptops, HP uses a combination of:

  • Thermal grease (paste) for the CPU and GPU die surfaces.
  • Thermal gel for certain VRM and power delivery components.
  • Thermal pads for memory modules and other flat-surfaced components.

These materials are applied at the factory and are chosen based on the thermal conductivity needs and contact pressure of each component.

Thermal Pad Thickness

While HP does not officially publish the exact thickness of thermal pads used in this model, community consensus and teardown experiences suggest:

  • 1.0mm thermal pads are generally safe and commonly used for VRAM and VRM modules.
  • Some users have reported using 0.5mm to 1.5mm pads depending on the contact gap and pressure tolerance.

If you're replacing thermal pads, it's best to measure the original ones using a caliper before removal. If that's not possible, start with 1.0mm and check for proper contact after reassembly.

Placement Guide

Refer to Page 58 of the Maintenance and Service Guide for the OMEN 16 series, which outlines the cooling system and thermal interface locations. You can download it here:

OMEN 16-xf0000 Maintenance and Service Guide – HP Support

Important Tips

  • Do not mix thermal paste and pads on the same surface.
  • Avoid replacing thermal gel with thermal paste unless you're sure of compatibility, some users have reported overheating after doing so.
  • Always disconnect the battery before disassembly.
  • Clean surfaces with 99% isopropyl alcohol and use compressed air to remove dust.

I hope your issue is now resolved. If not, feel free to reply and we’ll continue helping until everything’s sorted!

 

If the post helped, please click “Accepted Solution” to help other users easily find it. And if you’d like to say thanks, just tap the “Yes” button!

 

Cheers,

Max3Aj

HP Support

HP Recommended

I got it, I thought there were documents on the height of the thermal interface (like on video cards). The best option is to use good liquid thermal pads and phase transitions

HP Recommended

@SigHt1219, Thank you for your response. 

Using liquid metal or phase change thermal pads (like Fujipoly or Honeywell PCM) can significantly improve thermal conductivity, especially for VRMs and memory modules. 
Just keep in mind:

  • Liquid metal should only be used on bare metal surfaces (like CPU/GPU dies) and never on components with exposed electrical contacts (e.g., SMD capacitors or VRMs), unless you're insulating surrounding areas.
  • Phase change pads are great for consistent pressure zones and can outperform standard silicone pads in many cases.

If you're unsure about pad thickness:

  1. Use soft clay or modeling putty between the heatsink and component.
  2. Assemble the laptop and disassemble again.
  3. Measure the compressed clay with a caliper to estimate the gap.

I hope this helps!

 

If my response resolves your issue, please click “Accepted Solution” to help others find the answer. Also, don’t forget to click the “Yes” button to say thanks!

 

Take care and have a great day.

 

Max3Aj

HP Support

HP Recommended

Thank you, this is not the first time I service laptops and Omen (thank you, this model is without liquid metal). It was easier before, there were 1mm pads on the memory, 1-1.5mm on the VRM zone. Now in one laptop everything is filled with liquid, in the other one there are already regular ones. Although the laptops are almost identical (different series or batches). That's why I thought maybe there is some information so as not to mess around with selecting or buying good liquid thermal pads (when it is impossible to select)

HP Recommended

@SigHt1219, Thanks for reverting back. 

Is there anything else I can assist you with? 

If my response helped you, please click “Accepted Solution” to help others find the answer. Also, don’t forget to click the “Yes” button to say thanks!

 

Take care and have a great day.


Regards, 
Max3Aj

HP Recommended

Thanks for the answer. It turned out that the whole problem was in the liquid gaskets. I want to make a remark about how poorly they were applied, the contact on the video memory was very bad. That's why there was heating, which required maintenance (I can attach a photo). I applied a phase transition to the crystals (in the form of  0.2- 0.25 mm gaskets), and liquid, high-quality gaskets to the memory and video memory. In balanced mode, the laptop works almost without turning on the fans. Because the temperature is excellent, and heating only in performance mode at 70-105 W for the processor and 140 W for the video card. It turns out that HP has now switched to liquid thermal interface in new models.

HP Recommended

@SigHt1219, Thank you for taking the time to share your detailed findings and experience with your OMEN 16-xf0000. We truly appreciate the effort you put into investigating the thermal interface materials and sharing your results with the community.

 

HP continually evaluates design choices, including the use of liquid thermal compounds and pads, to balance performance, thermals, and long-term reliability. Your feedback about thermal pad application and memory module coverage has been noted and forwarded to our engineering team.

 

We are glad to hear that your adjustments have improved the thermal performance of your system, and that you are now experiencing quieter operation and stable temperatures. Insights like yours are valuable for both our product teams and other OMEN users looking to optimize their systems.

 

Best regards, 

Max3Aj

† The opinions expressed above are the personal opinions of the authors, not of HP. By using this site, you accept the <a href="https://www8.hp.com/us/en/terms-of-use.html" class="udrlinesmall">Terms of Use</a> and <a href="/t5/custom/page/page-id/hp.rulespage" class="udrlinesmall"> Rules of Participation</a>.