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- What is the white thermal paste used in OMEN 16t-u000?

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05-11-2025 10:48 PM
Hi everyone,
I’m currently working on my laptop (Model: 16t-u000).While cleaning the heatsink, I accidentally removed the white foam-like thermal material that was originally applied to certain components
Does anyone know what this white thermal paste is?
Thank you in advance!
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Accepted Solutions
05-16-2025 06:38 AM
@tetsuyaa, You're very welcome, glad to hear the info helped, and thanks for your detailed follow-up!
@Hawks_Eye is away for now. I am happy to assist you here,
You're absolutely right in noticing that HP often uses a mix of thermal solutions inside laptops like the OMEN 16t-u000. In addition to traditional thermal pads, some areas (especially around VRMs or VRAM) may use a white or gray viscous thermal compound—sometimes referred to as thermal putty or a phase-change thermal interface material.
Yes, K5-PRO is a valid and appropriate substitute for the original soft thermal putty used in many HP systems.
It’s designed for exactly this purpose: replacing soft thermal pads or putty in areas like:
- VRMs (Voltage Regulator Modules)
- VRAM chips
- Power delivery components
K5-PRO works well in scenarios where:
- The gap between the heatsink and the component is between ~0.5mm and 2mm
- You’re not applying it to the CPU or GPU die (those should use traditional thermal paste like Arctic MX-4, Kryonaut, etc.)
So, using K5-PRO is a smart move, especially if you’re unsure of the exact pad thickness—it helps accommodate slight variations in gap size.
I hope this helps!
If my response resolves your issue, please click “Accepted Solution” to help others find the answer. Also, don’t forget to click the “Yes” button to say thanks!
Take care and have a great day.
Max3Aj
HP Support
05-13-2025 09:14 AM
Hi @tetsuyaa
Welcome to the HP Support Community!
Thanks for posting your query! We're here to help you get back up and running.
The white thermal material you removed from your OMEN 16t-u000 is likely thermal pads rather than traditional thermal paste. These pads are used to bridge the gap between certain components and the heatsink, ensuring proper heat dissipation.
If you're looking to replace them, here are a few things to consider:
- Material Type: HP typically uses silicone-based thermal pads with specific thicknesses.
- Thickness: Common thicknesses range from 0.5mm to 2mm, depending on the component.
If my response helped, please mark it as an Accepted Solution! ✅ It helps others and spreads support. 💙 Also, tapping "Yes" on "Was this reply helpful?" makes a big difference! Thanks! 😊
Take care, and have an amazing day!
Regards,
Hawks_Eye
If my response helped, please mark it as an Accepted Solution! ✅ It helps others and spreads support. Also, tapping "Yes" on "Was this reply helpful?" makes a big difference! Thanks!
05-13-2025 12:56 PM
Hi @Hawks_Eye,
Thanks so much for your detailed response!
From what I observed while disassembling the heatsink, it actually seemed like some areas were using grease or putty-like material instead of solid thermal pads. I couldn’t determine the exact thickness for each location.
To address this, I’ve ordered a syringe of K5-PRO Viscous Thermal Paste (the type designed to replace thermal pads in VRM areas).
I wanted to ask:
Is K5-PRO an appropriate substitute for the original thermal pad/putty material HP used?
Do you happen to know if HP used any specific thickness standards across different parts of the OMEN 16t-u000
Thanks again for your help—really appreciate the insight!
Best regards,
Xuzhe
05-16-2025 06:38 AM
@tetsuyaa, You're very welcome, glad to hear the info helped, and thanks for your detailed follow-up!
@Hawks_Eye is away for now. I am happy to assist you here,
You're absolutely right in noticing that HP often uses a mix of thermal solutions inside laptops like the OMEN 16t-u000. In addition to traditional thermal pads, some areas (especially around VRMs or VRAM) may use a white or gray viscous thermal compound—sometimes referred to as thermal putty or a phase-change thermal interface material.
Yes, K5-PRO is a valid and appropriate substitute for the original soft thermal putty used in many HP systems.
It’s designed for exactly this purpose: replacing soft thermal pads or putty in areas like:
- VRMs (Voltage Regulator Modules)
- VRAM chips
- Power delivery components
K5-PRO works well in scenarios where:
- The gap between the heatsink and the component is between ~0.5mm and 2mm
- You’re not applying it to the CPU or GPU die (those should use traditional thermal paste like Arctic MX-4, Kryonaut, etc.)
So, using K5-PRO is a smart move, especially if you’re unsure of the exact pad thickness—it helps accommodate slight variations in gap size.
I hope this helps!
If my response resolves your issue, please click “Accepted Solution” to help others find the answer. Also, don’t forget to click the “Yes” button to say thanks!
Take care and have a great day.
Max3Aj
HP Support