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01-25-2022
05:42 AM
- last edited on
01-25-2022
08:10 AM
by
Ric_ob
Hi,
When I run system diagnostic tool-Memory Test, I receive an eror message which basically says that test failed
Failure ID: 9EKSXG-000B0R-8D4WXG-007403
What does this failure ID refer to?
01-25-2022 06:40 AM
Hi:
Below is the failure report generated by the code you posted, minus your PC's serial number.
9EKSXG-000B0R-8D4WXG-007403 | OK | 0000000000 | 1/25/22 | 0 | System/Processor Board | Backplane Board, System Board, Processor, Processor Board | BGA integrity |
Seems like there is a problem with either the motherboard or the processor.
See the service manual at the link below for the troubleshooting steps.
01-25-2022 03:24 PM
I am going to make the following suggestions as I have been able to repair computers with similar problems: Erratic memory failures, lost memory capacity or inexplicable software hang.
The first thing to try is to re-seat the memory modules, ensuring that they are properly seated.
The second thing is to re-test and see if the problem persists. If it does, switch memory module
positions and see if the problem follows a DIMM.
The third thing is to try to re-seat the CPU. This can be tricky. Sometimes, one or more of the needle-like
socket pins have attached themselves to the CPU by means of galvanic corrosion/metal migration. This requires careful
attention so that the processor is not dropped or misaligned when re-seated.
The forth thing is to remove the motherboard from the computer case.
Check underneath the processor socket. If there is a metal plate acting as a support plate in order to prevent
the mobo from being bent due to CPU-cooler pressure there could be a thin plastic sheet acting as insulation
between the fiber glass mobo and the metal plate. Now, the metal support structure of the socket has to be taken apart
(a number of hex screws) and the insulating plastic sheet can be removed. Check carefully for any tin-plated via holes
where excesseive solder has penetrated the plastic sheet creating a short between the copper trace/via and the metal
structure bottom plate.