HP Z840 Memory upgrade issue

[DrMutty]

So I am trying to upgrade the  memory capacity of my dual cpu z840. I havepurchased 128 gb 8 x 16 gb kit I have been getting nothing but 5 beeps from the new kit. I put back in the original 3 x 16gb and the system works, I add one of the new kit and it works I add another stick it works .. I can add 6 sticks to get to 96 gb ... and then the system fails to boot .. no beeps .. just a silent fail. I have changed all the sticks around and they all work fine. It isn't the memory it is something else. The memory holder all look pristine and have never been used afaik, no dust, but I have cleaned them anyway. I am at a loss now.

The oddest thing is that I have to have the original sticks in for the rest of the sticks to work. Confirmed working sticks placed into the first 3 slots results in 5 beeps, replaceing the original sticks .. works adding sticks that just made the system fail now work in slots 4-5-6. It makes no sense unless there is some magical properties to those 3 sticks of 16gb SK HYNIX whose only difference is the HP sticker on one side, the SK Hynix label is the exact same, verbatim.

I have read the posts offering advice like 'reseat the cpu because that fixes the memory controller' (really ? I may as well rattle some beads over the system and talk in tongues) and other fantastical suggestions.

Any idea's beyond the equivilant of turn it off and on again please. I just want dual channel memory, is that too much to ask ?

Also the memory is the EXACT same make/model as the original HP SK HYNIX ddr4 2400t .. the exact same !

[DrMutty]

Bumping this to the top, with a little more information I have gleaned.

I used RAMMON to take a closer look at the memory I have installed. The results are interesting but do not exactly make sense or offer a solution.

I'll include the report html.

Of interest are

A: The modules have exactly the same modules part {HMA82GR7MFR 4N-UH}.

B: The original modules (3x16gb) Have 17 Addressing bits : Device Width 4: #Ranks 1: Minimum Four Activate Window Delay (ns) of 13.000 : Raw Card C Rev. 18

C: The new kit (8 x 16gb) have 16 Addressing Bits : Device Width 8: #Rank 2: Minimum Four Activate Window Delay (ns) of 21.000 :Raw Card E Rev.18

So as I now understand it the memory differs because it is dual rank. Everything else is basically the same.

Whilst this might account for the sticks not working with the old single rank, it doesn;t explain why I managed to get 3 sticks working or why the new kit that are all the same will not work without the original memory configuration.

RAMMON report

Spoiler

RAMMon v2.0 Build: 1000 built with SysInfo v2.3 Build: 1000
PassMark (R) Software - www.passmark.com

Memory Summary For DESKTOP-VQLN2U8

Number of Memory Devices: 6	Total Physical Memory: 98219 MB (98304 MB)
				Total Available Physical Memory: 88044 MB
				Memory Load: 10%	

Item Slot #1 Slot #2 Slot #3 Slot #4 Slot #5 Slot #6 Slot #7 Slot #8 Slot #9 Slot #10 Slot #11 Slot #12 Slot #13 Slot #14 Slot #15 Slot #16

Ram Type	DDR4	DDR4	DDR4	DDR4	DDR4	DDR4	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated
Maximum Clock Speed (MHz)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)
Maximum Transfer Speed (MHz)	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400
Maximum Bandwidth (MB/s)	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200
Memory Capacity (MB)	16384	16384	16384	16384	16384	16384
Jedec Manufacture Name	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Search Amazon.com	Search!	Search!	Search!	Search!	Search!	Search!
SPD Revision	1.1	1.1	1.1	1.1	1.1	1.1
Registered	Yes	Yes	Yes	Yes	Yes	Yes
ECC	Yes	Yes	Yes	Yes	Yes	Yes
On-Die ECC	No	No	No	No	No	No
DIMM Slot #	1	2	3	4	5	6
Manufactured	Week 3 of Year 2018	Week 3 of Year 2018	Week 19 of Year 2016	Week 3 of Year 2018	Week 19 of Year 2016	Week 19 of Year 2016
Module Part #	HMA82GR7MFR4N-UH	HMA82GR7MFR4N-UH	HMA82GR7MFR8N-UH	HMA82GR7MFR4N-UH	HMA82GR7MFR8N-UH	HMA82GR7MFR8N-UH
Module Revision	0x0	0x0	0x0	0x0	0x0	0x0
Module Serial #	0x11CDB05D	0x11CDB0F5	0x9170FEB8	0x11CDB0A9	0x9170FEEE	0x9170FEA9
Module Manufacturing Location	1	1	1	1	1	1
# of Row Addressing Bits	17	17	16	17	16	16
# of Column Addressing Bits	10	10	10	10	10	10
# of Banks	16	16	16	16	16	16
# of Ranks	1	1	2	1	2	2
Device Width in Bits	4	4	8	4	8	8
Bus Width in Bits	64	64	64	64	64	64
Module Voltage	1.2V	1.2V	1.2V	1.2V	1.2V	1.2V
CAS Latencies Supported	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18
Timings @ Max Frequency (JEDEC)	17-17-17-39	17-17-17-39	17-17-17-39	17-17-17-39	17-17-17-39	17-17-17-39
Maximum frequency (MHz)	1200	1200	1200	1200	1200	1200
Maximum Transfer Speed (MHz)	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400
Maximum Bandwidth (MB/s)	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200
Minimum Clock Cycle Time, tCK (ns)	0.833	0.833	0.833	0.833	0.833	0.833
Minimum CAS Latency Time, tAA (ns)	13.750	13.750	13.750	13.750	13.750	13.750
Minimum RAS to CAS Delay, tRCD (ns)	13.750	13.750	13.750	13.750	13.750	13.750
Minimum Row Precharge Time, tRP (ns)	13.750	13.750	13.750	13.750	13.750	13.750
Minimum Active to Precharge Time, tRAS (ns)	32.000	32.000	32.000	32.000	32.000	32.000
Minimum Row Active to Row Active Delay, tRRD (ns)	3.300	3.300	3.300	3.300	3.300	3.300
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns)	45.750	45.750	45.750	45.750	45.750	45.750
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns)	350.000	350.000	350.000	350.000	350.000	350.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns)	1.600	1.600	1.600	1.600	1.600	1.600
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns)	260.000	260.000	260.000	260.000	260.000	260.000
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns)	160.000	160.000	160.000	160.000	160.000	160.000
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns)	3.300	3.300	3.300	3.300	3.300	3.300
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns)	4.900	4.900	4.900	4.900	4.900	4.900
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns)	5.000	5.000	5.000	5.000	5.000	5.000
Minimum Four Activate Window Delay (ns)	13.000	13.000	21.000	13.000	21.000	21.000
Maximum Activate Window in units of tREFI	8192	8192	8192	8192	8192	8192
Thermal Sensor Present	Yes	Yes	Yes	Yes	Yes	Yes
DRAM Stepping	255	255	255	255	255	255
DRAM Manufacture	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
SDRAM Package Type	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack
Maximum Activate Count (MAC)	Unlimited MAC	Unlimited MAC	Unlimited MAC	Unlimited MAC	Unlimited MAC	Unlimited MAC
Post Package Repair Supported	Yes	Yes	Yes	Yes	Yes	Yes
Module Type	RDIMM	RDIMM	RDIMM	RDIMM	RDIMM	RDIMM
Module Height (mm)	32	32	32	32	32	32
Module Thickness (front), (mm)	2	2	2	2	2	2
Module Thickness (back), (mm)	2	2	2	2	2	2
Reference Raw Card Used	Raw Card C Rev. 18	Raw Card C Rev. 18	Raw Card E Rev. 18	Raw Card C Rev. 18	Raw Card E Rev. 18	Raw Card E Rev. 18
# of DRAM Rows	1	1	1	1	1	1
# of Registers	1	1	1	1	1	1
Heat Spreader Solution Present	No	No	No	No	No	No
Register Manufacturer	IDT	IDT	IDT	IDT	IDT	IDT
Register Revision	30	30	30	30	30	30
Chip Select Drive Strength	Moderate Drive	Moderate Drive	Light Drive	Moderate Drive	Light Drive	Light Drive
Command/Address Drive Strength	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive
ODT Drive Strength	Moderate Drive	Moderate Drive	Light Drive	Moderate Drive	Light Drive	Light Drive
CKE Drive Strength	Moderate Drive	Moderate Drive	Light Drive	Moderate Drive	Light Drive	Light Drive
Y0,Y2 Drive Strength	Moderate Drive	Moderate Drive	Light Drive	Moderate Drive	Light Drive	Light Drive
Y1,Y3 Drive Strength	Moderate Drive	Moderate Drive	Light Drive	Moderate Drive	Light Drive	Light Drive

[mals26]

Here is the report from mine, don't really have much to add other than the usual check for bent pins on the sockets, try to reseat the cpu's and look for damaged traces on the motherboard.

Report

Spoiler

RAMMon v2.0 Build: 1000 built with SysInfo v2.3 Build: 1000
PassMark (R) Software - www.passmark.com

Memory Summary For Z840

Number of Memory Devices: 8	Total Physical Memory: 130979 MB (131072 MB)
				Total Available Physical Memory: 117363 MB
				Memory Load: 10%	

Item Slot #1 Slot #2 Slot #3 Slot #4 Slot #5 Slot #6 Slot #7 Slot #8 Slot #9 Slot #10 Slot #11 Slot #12 Slot #13 Slot #14 Slot #15 Slot #16

Ram Type	DDR4	DDR4	DDR4	DDR4	DDR4	DDR4	DDR4	DDR4	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated	Not Populated
Maximum Clock Speed (MHz)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)	1200 (JEDEC)
Maximum Transfer Speed (MHz)	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400
Maximum Bandwidth (MB/s)	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200
Memory Capacity (MB)	16384	16384	16384	16384	16384	16384	16384	16384
Jedec Manufacture Name	Samsung	Samsung	Samsung	Samsung	Samsung	Samsung	Samsung	Samsung
Search Amazon.com	Search!	Search!	Search!	Search!	Search!	Search!	Search!	Search!
SPD Revision	1.1	1.1	1.1	1.1	1.1	1.1	1.1	1.1
Registered	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
ECC	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
On-Die ECC	No	No	No	No	No	No	No	No
DIMM Slot #	1	2	3	4	5	6	7	8
Manufactured	Week 14 of Year 2017	Week 34 of Year 2017	Week 34 of Year 2017	Week 34 of Year 2017	Week 14 of Year 2017	Week 34 of Year 2017	Week 34 of Year 2017	Week 34 of Year 2017
Module Part #	M393A2K40BB1-CRC	M393A2K40BB1-CRC	M393A2K40BB1-CRC	M393A2K40BB1-CRC	M393A2K40BB1-CRC	M393A2K40BB1-CRC	M393A2K40BB1-CRC	M393A2K40BB1-CRC
Module Revision	0x0	0x0	0x0	0x0	0x0	0x0	0x0	0x0
Module Serial #	0x355A9081	0x36928914	0x369293BD	0x36928984	0x355A90D3	0x36928A48	0x369287AD	0x36929328
Module Manufacturing Location	2	2	2	2	2	2	2	2
# of Row Addressing Bits	17	17	17	17	17	17	17	17
# of Column Addressing Bits	10	10	10	10	10	10	10	10
# of Banks	16	16	16	16	16	16	16	16
# of Ranks	1	1	1	1	1	1	1	1
Device Width in Bits	4	4	4	4	4	4	4	4
Bus Width in Bits	64	64	64	64	64	64	64	64
Module Voltage	1.2V	1.2V	1.2V	1.2V	1.2V	1.2V	1.2V	1.2V
CAS Latencies Supported	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18	10 11 12 13 14 15 16 17 18
Timings @ Max Frequency (JEDEC)	17-17-17-39	17-17-17-39	17-17-17-39	17-17-17-39	17-17-17-39	17-17-17-39	17-17-17-39	17-17-17-39
Maximum frequency (MHz)	1200	1200	1200	1200	1200	1200	1200	1200
Maximum Transfer Speed (MHz)	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400	DDR4-2400
Maximum Bandwidth (MB/s)	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200	PC4-19200
Minimum Clock Cycle Time, tCK (ns)	0.833	0.833	0.833	0.833	0.833	0.833	0.833	0.833
Minimum CAS Latency Time, tAA (ns)	13.750	13.750	13.750	13.750	13.750	13.750	13.750	13.750
Minimum RAS to CAS Delay, tRCD (ns)	13.750	13.750	13.750	13.750	13.750	13.750	13.750	13.750
Minimum Row Precharge Time, tRP (ns)	13.750	13.750	13.750	13.750	13.750	13.750	13.750	13.750
Minimum Active to Precharge Time, tRAS (ns)	32.000	32.000	32.000	32.000	32.000	32.000	32.000	32.000
Minimum Row Active to Row Active Delay, tRRD (ns)	3.300	3.300	3.300	3.300	3.300	3.300	3.300	3.300
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns)	45.750	45.750	45.750	45.750	45.750	45.750	45.750	45.750
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns)	350.000	350.000	350.000	350.000	350.000	350.000	350.000	350.000
DDR4 Specific SPD Attributes
Maximum Clock Cycle Time, tCKmax (ns)	1.600	1.600	1.600	1.600	1.600	1.600	1.600	1.600
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns)	260.000	260.000	260.000	260.000	260.000	260.000	260.000	260.000
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns)	160.000	160.000	160.000	160.000	160.000	160.000	160.000	160.000
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns)	3.300	3.300	3.300	3.300	3.300	3.300	3.300	3.300
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns)	4.900	4.900	4.900	4.900	4.900	4.900	4.900	4.900
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns)	5.000	5.000	5.000	5.000	5.000	5.000	5.000	5.000
Minimum Four Activate Window Delay (ns)	13.000	13.000	13.000	13.000	13.000	13.000	13.000	13.000
Maximum Activate Window in units of tREFI	8192	8192	8192	8192	8192	8192	8192	8192
Thermal Sensor Present	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
DRAM Stepping	0	0	0	0	0	0	0	0
DRAM Manufacture	Samsung	Samsung	Samsung	Samsung	Samsung	Samsung	Samsung	Samsung
SDRAM Package Type	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack	Monolithic, 1 die, Single load stack
Maximum Activate Count (MAC)	Unlimited MAC	Unlimited MAC	Unlimited MAC	Unlimited MAC	Unlimited MAC	Unlimited MAC	Unlimited MAC	Unlimited MAC
Post Package Repair Supported	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Module Type	RDIMM	RDIMM	RDIMM	RDIMM	RDIMM	RDIMM	RDIMM	RDIMM
Module Height (mm)	32	32	32	32	32	32	32	32
Module Thickness (front), (mm)	2	2	2	2	2	2	2	2
Module Thickness (back), (mm)	2	2	2	2	2	2	2	2
Reference Raw Card Used	Raw Card C Rev. 18	Raw Card C Rev. 18	Raw Card C Rev. 18	Raw Card C Rev. 18	Raw Card C Rev. 18	Raw Card C Rev. 18	Raw Card C Rev. 18	Raw Card C Rev. 18
# of DRAM Rows	1	1	1	1	1	1	1	1
# of Registers	1	1	1	1	1	1	1	1
Heat Spreader Solution Present	No	No	No	No	No	No	No	No
Register Manufacturer	Montage Technology Group	Montage Technology Group	Montage Technology Group	Montage Technology Group	Montage Technology Group	Montage Technology Group	Montage Technology Group	Montage Technology Group
Register Revision	C0	C0	C0	C0	C0	C0	C0	C0
Chip Select Drive Strength	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive
Command/Address Drive Strength	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive
ODT Drive Strength	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive
CKE Drive Strength	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive
Y0,Y2 Drive Strength	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive
Y1,Y3 Drive Strength	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive	Moderate Drive

[DGroves]

you cannot mix single rank with dual rank in the same memory bank/channel (each bank nust be all single or dual rank)

the z840 has four memory channels per CPU  (if dual cpu's you have 8 channels)

the dimm slot order for cpu 1 should mirrored cpu 2

example: channel 1 must be all single rank dimms

                   channel 2 must be all dual rank dimms

                   channel 2 must be all dual rank dimms

                   channel 4 must be all single rank dimms

To realize full performance at least 1 DIMM must be inserted into each channel,  this enables max membandwidth

You cannot intermix LR DIMMs with Registered DIMMs

Types of memory supported on an HP Z840 are:
• 4 GB, 8 GB, 16 GB, and 32 GB PC4-2400R 2400 MHz DDR4 Registered DIMMs supported on Intel® Broadwell (v4) processors
• 4 GB, 8 GB, and 16 GB PC4-2133R MHz DDR4 Registered DIMMs supported on Intel® Haswell (v3) processors
• 64 GB and 128 GB PC4-2400 2400 MHz DDR4 LR DIMMs supported on Intel® Broadwell (v4) processors
• 32 GB, 64 GB, and 128 GB PC4-2133R 2133 MHz LR DIMMs supported on Intel® Haswell (v3) processors
• Single and dual rank 4 GB and 8 GB based DIMMs are supported
• Quad and octal rank 4 GB and 8 GB based LR DIMMs are supported
Types of memory NOT supported on an HP Z840 are:
• Unbuffered DIMMs
• Non-ECC DIMMs
• DDR, DDR2, or DDR3 DIMMs

https://zworkstations.com/site/assets/files/1044/hp-z840-technical-white-paper.pdf

[DrMutty]

Thanks for your reply.

I ordered eight sticks of single rank 16gb memory. The installation went without issue and the system booted up first time and saw all the memory.

I have encountered another issue which doesn't make sense. Windows sees all 192gb installed in three channel configurations (as the whitepaper indicates) but the HP Support Assistant only recognizes the 128gb in dual channel (first eight slots) and reports only eight banks of ram. HP Support Assistant is the latest and greatest version. I am not too bothered because Windows install see's all the ram installed, I just worry there is some problem lurking silently waiting for the day the system tries to use those upper memory slots not being recognized.

[DGroves]

if a single cpu, using 16GB dimms slots 1/2/3 (skip 4/5)  6/7/8 should be filled which = 192GB total

if a dual cpu, then use 1/3/6/8 for the first cpu, and  1/3/6/8 for the sec cpu

for dual cpu's the memory slot order MUST BE THE SAME between cpu's

your current config is not correct as it appears the first cpu has more ram slots used

please refer to the HP z820/840 memory load order directions

your z840 has 8 dimm slots per CPU IE- dual cpu's will have 16 dimm slots (8 per cpu)

read the HP white paper link below for proper ram load order (page 23 - 25)

https://zworkstations.com/site/assets/files/1044/hp-z840-technical-white-paper.pdf

Loading rules
• Load the memory modules in order of size, starting with the largest module and finishing with
the smallest module.
• Each channel includes two DIMM sockets; black and white connector pairs represent a channel.
For a single processor configuration, the DIMMs should be loaded first in the black sockets and
then in the white sockets. The DIMMs should be loaded starting with the DIMM furthest from the
CPU, with the first DIMM loaded in the bottom most socket and alternating sides of the CPU.
• For a dual processor configuration, follow the loading order above, but alternate between the
2 processors.