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- HP Z840 Memory upgrade issue

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03-19-2022 10:41 AM - edited 03-19-2022 10:57 AM
So I am trying to upgrade the memory capacity of my dual cpu z840. I havepurchased 128 gb 8 x 16 gb kit I have been getting nothing but 5 beeps from the new kit. I put back in the original 3 x 16gb and the system works, I add one of the new kit and it works I add another stick it works .. I can add 6 sticks to get to 96 gb ... and then the system fails to boot .. no beeps .. just a silent fail. I have changed all the sticks around and they all work fine. It isn't the memory it is something else. The memory holder all look pristine and have never been used afaik, no dust, but I have cleaned them anyway. I am at a loss now.
The oddest thing is that I have to have the original sticks in for the rest of the sticks to work. Confirmed working sticks placed into the first 3 slots results in 5 beeps, replaceing the original sticks .. works adding sticks that just made the system fail now work in slots 4-5-6. It makes no sense unless there is some magical properties to those 3 sticks of 16gb SK HYNIX whose only difference is the HP sticker on one side, the SK Hynix label is the exact same, verbatim.
I have read the posts offering advice like 'reseat the cpu because that fixes the memory controller' (really ? I may as well rattle some beads over the system and talk in tongues) and other fantastical suggestions.
Any idea's beyond the equivilant of turn it off and on again please. I just want dual channel memory, is that too much to ask ?
Also the memory is the EXACT same make/model as the original HP SK HYNIX ddr4 2400t .. the exact same !
03-20-2022
06:44 AM
- last edited on
03-21-2022
02:06 PM
by
RodrigoB
Bumping this to the top, with a little more information I have gleaned.
I used RAMMON to take a closer look at the memory I have installed. The results are interesting but do not exactly make sense or offer a solution.
I'll include the report html.
Of interest are
A: The modules have exactly the same modules part {HMA82GR7MFR 4N-UH}.
B: The original modules (3x16gb) Have 17 Addressing bits : Device Width 4: #Ranks 1: Minimum Four Activate Window Delay (ns) of 13.000 : Raw Card C Rev. 18
C: The new kit (8 x 16gb) have 16 Addressing Bits : Device Width 8: #Rank 2: Minimum Four Activate Window Delay (ns) of 21.000 :Raw Card E Rev.18
So as I now understand it the memory differs because it is dual rank. Everything else is basically the same.
Whilst this might account for the sticks not working with the old single rank, it doesn;t explain why I managed to get 3 sticks working or why the new kit that are all the same will not work without the original memory configuration.
RAMMON report
RAMMon v2.0 Build: 1000 built with SysInfo v2.3 Build: 1000
PassMark (R) Software - www.passmark.com
Number of Memory Devices: 6 Total Physical Memory: 98219 MB (98304 MB) Total Available Physical Memory: 88044 MB Memory Load: 10%
Item Slot #1 Slot #2 Slot #3 Slot #4 Slot #5 Slot #6 Slot #7 Slot #8 Slot #9 Slot #10 Slot #11 Slot #12 Slot #13 Slot #14 Slot #15 Slot #16
Ram Type | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated |
Maximum Clock Speed (MHz) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | ||||||||||
Maximum Transfer Speed (MHz) | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | ||||||||||
Maximum Bandwidth (MB/s) | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | ||||||||||
Memory Capacity (MB) | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | ||||||||||
Jedec Manufacture Name | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | ||||||||||
Search Amazon.com | Search! | Search! | Search! | Search! | Search! | Search! | ||||||||||
SPD Revision | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | ||||||||||
Registered | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||||
ECC | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||||
On-Die ECC | No | No | No | No | No | No | ||||||||||
DIMM Slot # | 1 | 2 | 3 | 4 | 5 | 6 | ||||||||||
Manufactured | Week 3 of Year 2018 | Week 3 of Year 2018 | Week 19 of Year 2016 | Week 3 of Year 2018 | Week 19 of Year 2016 | Week 19 of Year 2016 | ||||||||||
Module Part # | HMA82GR7MFR4N-UH | HMA82GR7MFR4N-UH | HMA82GR7MFR8N-UH | HMA82GR7MFR4N-UH | HMA82GR7MFR8N-UH | HMA82GR7MFR8N-UH | ||||||||||
Module Revision | 0x0 | 0x0 | 0x0 | 0x0 | 0x0 | 0x0 | ||||||||||
Module Serial # | 0x11CDB05D | 0x11CDB0F5 | 0x9170FEB8 | 0x11CDB0A9 | 0x9170FEEE | 0x9170FEA9 | ||||||||||
Module Manufacturing Location | 1 | 1 | 1 | 1 | 1 | 1 | ||||||||||
# of Row Addressing Bits | 17 | 17 | 16 | 17 | 16 | 16 | ||||||||||
# of Column Addressing Bits | 10 | 10 | 10 | 10 | 10 | 10 | ||||||||||
# of Banks | 16 | 16 | 16 | 16 | 16 | 16 | ||||||||||
# of Ranks | 1 | 1 | 2 | 1 | 2 | 2 | ||||||||||
Device Width in Bits | 4 | 4 | 8 | 4 | 8 | 8 | ||||||||||
Bus Width in Bits | 64 | 64 | 64 | 64 | 64 | 64 | ||||||||||
Module Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | ||||||||||
CAS Latencies Supported | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | ||||||||||
Timings @ Max Frequency (JEDEC) | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | ||||||||||
Maximum frequency (MHz) | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | ||||||||||
Maximum Transfer Speed (MHz) | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | ||||||||||
Maximum Bandwidth (MB/s) | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | ||||||||||
Minimum Clock Cycle Time, tCK (ns) | 0.833 | 0.833 | 0.833 | 0.833 | 0.833 | 0.833 | ||||||||||
Minimum CAS Latency Time, tAA (ns) | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | ||||||||||
Minimum RAS to CAS Delay, tRCD (ns) | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | ||||||||||
Minimum Row Precharge Time, tRP (ns) | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | ||||||||||
Minimum Active to Precharge Time, tRAS (ns) | 32.000 | 32.000 | 32.000 | 32.000 | 32.000 | 32.000 | ||||||||||
Minimum Row Active to Row Active Delay, tRRD (ns) | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | ||||||||||
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 45.750 | 45.750 | 45.750 | 45.750 | 45.750 | 45.750 | ||||||||||
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 350.000 | 350.000 | 350.000 | 350.000 | 350.000 | 350.000 | ||||||||||
DDR4 Specific SPD Attributes | ||||||||||||||||
Maximum Clock Cycle Time, tCKmax (ns) | 1.600 | 1.600 | 1.600 | 1.600 | 1.600 | 1.600 | ||||||||||
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 260.000 | 260.000 | 260.000 | 260.000 | 260.000 | 260.000 | ||||||||||
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 160.000 | 160.000 | 160.000 | 160.000 | 160.000 | 160.000 | ||||||||||
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns) | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | ||||||||||
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns) | 4.900 | 4.900 | 4.900 | 4.900 | 4.900 | 4.900 | ||||||||||
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns) | 5.000 | 5.000 | 5.000 | 5.000 | 5.000 | 5.000 | ||||||||||
Minimum Four Activate Window Delay (ns) | 13.000 | 13.000 | 21.000 | 13.000 | 21.000 | 21.000 | ||||||||||
Maximum Activate Window in units of tREFI | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | ||||||||||
Thermal Sensor Present | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||||
DRAM Stepping | 255 | 255 | 255 | 255 | 255 | 255 | ||||||||||
DRAM Manufacture | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | ||||||||||
SDRAM Package Type | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | ||||||||||
Maximum Activate Count (MAC) | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | ||||||||||
Post Package Repair Supported | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||||
Module Type | RDIMM | RDIMM | RDIMM | RDIMM | RDIMM | RDIMM | ||||||||||
Module Height (mm) | 32 | 32 | 32 | 32 | 32 | 32 | ||||||||||
Module Thickness (front), (mm) | 2 | 2 | 2 | 2 | 2 | 2 | ||||||||||
Module Thickness (back), (mm) | 2 | 2 | 2 | 2 | 2 | 2 | ||||||||||
Reference Raw Card Used | Raw Card C Rev. 18 | Raw Card C Rev. 18 | Raw Card E Rev. 18 | Raw Card C Rev. 18 | Raw Card E Rev. 18 | Raw Card E Rev. 18 | ||||||||||
# of DRAM Rows | 1 | 1 | 1 | 1 | 1 | 1 | ||||||||||
# of Registers | 1 | 1 | 1 | 1 | 1 | 1 | ||||||||||
Heat Spreader Solution Present | No | No | No | No | No | No | ||||||||||
Register Manufacturer | IDT | IDT | IDT | IDT | IDT | IDT | ||||||||||
Register Revision | 30 | 30 | 30 | 30 | 30 | 30 | ||||||||||
Chip Select Drive Strength | Moderate Drive | Moderate Drive | Light Drive | Moderate Drive | Light Drive | Light Drive | ||||||||||
Command/Address Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||||||||
ODT Drive Strength | Moderate Drive | Moderate Drive | Light Drive | Moderate Drive | Light Drive | Light Drive | ||||||||||
CKE Drive Strength | Moderate Drive | Moderate Drive | Light Drive | Moderate Drive | Light Drive | Light Drive | ||||||||||
Y0,Y2 Drive Strength | Moderate Drive | Moderate Drive | Light Drive | Moderate Drive | Light Drive | Light Drive | ||||||||||
Y1,Y3 Drive Strength | Moderate Drive | Moderate Drive | Light Drive | Moderate Drive | Light Drive | Light Drive |
03-20-2022
08:57 AM
- last edited on
03-21-2022
02:07 PM
by
RodrigoB
Here is the report from mine, don't really have much to add other than the usual check for bent pins on the sockets, try to reseat the cpu's and look for damaged traces on the motherboard.
Report
RAMMon v2.0 Build: 1000 built with SysInfo v2.3 Build: 1000
PassMark (R) Software - www.passmark.com
Number of Memory Devices: 8 Total Physical Memory: 130979 MB (131072 MB) Total Available Physical Memory: 117363 MB Memory Load: 10%
Item Slot #1 Slot #2 Slot #3 Slot #4 Slot #5 Slot #6 Slot #7 Slot #8 Slot #9 Slot #10 Slot #11 Slot #12 Slot #13 Slot #14 Slot #15 Slot #16
Ram Type | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 | DDR4 | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated | Not Populated |
Maximum Clock Speed (MHz) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | 1200 (JEDEC) | ||||||||
Maximum Transfer Speed (MHz) | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | ||||||||
Maximum Bandwidth (MB/s) | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | ||||||||
Memory Capacity (MB) | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | ||||||||
Jedec Manufacture Name | Samsung | Samsung | Samsung | Samsung | Samsung | Samsung | Samsung | Samsung | ||||||||
Search Amazon.com | Search! | Search! | Search! | Search! | Search! | Search! | Search! | Search! | ||||||||
SPD Revision | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | ||||||||
Registered | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||
ECC | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||
On-Die ECC | No | No | No | No | No | No | No | No | ||||||||
DIMM Slot # | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | ||||||||
Manufactured | Week 14 of Year 2017 | Week 34 of Year 2017 | Week 34 of Year 2017 | Week 34 of Year 2017 | Week 14 of Year 2017 | Week 34 of Year 2017 | Week 34 of Year 2017 | Week 34 of Year 2017 | ||||||||
Module Part # | M393A2K40BB1-CRC | M393A2K40BB1-CRC | M393A2K40BB1-CRC | M393A2K40BB1-CRC | M393A2K40BB1-CRC | M393A2K40BB1-CRC | M393A2K40BB1-CRC | M393A2K40BB1-CRC | ||||||||
Module Revision | 0x0 | 0x0 | 0x0 | 0x0 | 0x0 | 0x0 | 0x0 | 0x0 | ||||||||
Module Serial # | 0x355A9081 | 0x36928914 | 0x369293BD | 0x36928984 | 0x355A90D3 | 0x36928A48 | 0x369287AD | 0x36929328 | ||||||||
Module Manufacturing Location | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | ||||||||
# of Row Addressing Bits | 17 | 17 | 17 | 17 | 17 | 17 | 17 | 17 | ||||||||
# of Column Addressing Bits | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | ||||||||
# of Banks | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | ||||||||
# of Ranks | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | ||||||||
Device Width in Bits | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | ||||||||
Bus Width in Bits | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | ||||||||
Module Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | ||||||||
CAS Latencies Supported | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | 10 11 12 13 14 15 16 17 18 | ||||||||
Timings @ Max Frequency (JEDEC) | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | 17-17-17-39 | ||||||||
Maximum frequency (MHz) | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | ||||||||
Maximum Transfer Speed (MHz) | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | DDR4-2400 | ||||||||
Maximum Bandwidth (MB/s) | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | PC4-19200 | ||||||||
Minimum Clock Cycle Time, tCK (ns) | 0.833 | 0.833 | 0.833 | 0.833 | 0.833 | 0.833 | 0.833 | 0.833 | ||||||||
Minimum CAS Latency Time, tAA (ns) | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | ||||||||
Minimum RAS to CAS Delay, tRCD (ns) | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | ||||||||
Minimum Row Precharge Time, tRP (ns) | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | 13.750 | ||||||||
Minimum Active to Precharge Time, tRAS (ns) | 32.000 | 32.000 | 32.000 | 32.000 | 32.000 | 32.000 | 32.000 | 32.000 | ||||||||
Minimum Row Active to Row Active Delay, tRRD (ns) | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | ||||||||
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 45.750 | 45.750 | 45.750 | 45.750 | 45.750 | 45.750 | 45.750 | 45.750 | ||||||||
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 350.000 | 350.000 | 350.000 | 350.000 | 350.000 | 350.000 | 350.000 | 350.000 | ||||||||
DDR4 Specific SPD Attributes | ||||||||||||||||
Maximum Clock Cycle Time, tCKmax (ns) | 1.600 | 1.600 | 1.600 | 1.600 | 1.600 | 1.600 | 1.600 | 1.600 | ||||||||
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 260.000 | 260.000 | 260.000 | 260.000 | 260.000 | 260.000 | 260.000 | 260.000 | ||||||||
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 160.000 | 160.000 | 160.000 | 160.000 | 160.000 | 160.000 | 160.000 | 160.000 | ||||||||
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns) | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | 3.300 | ||||||||
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns) | 4.900 | 4.900 | 4.900 | 4.900 | 4.900 | 4.900 | 4.900 | 4.900 | ||||||||
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns) | 5.000 | 5.000 | 5.000 | 5.000 | 5.000 | 5.000 | 5.000 | 5.000 | ||||||||
Minimum Four Activate Window Delay (ns) | 13.000 | 13.000 | 13.000 | 13.000 | 13.000 | 13.000 | 13.000 | 13.000 | ||||||||
Maximum Activate Window in units of tREFI | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | ||||||||
Thermal Sensor Present | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||
DRAM Stepping | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | ||||||||
DRAM Manufacture | Samsung | Samsung | Samsung | Samsung | Samsung | Samsung | Samsung | Samsung | ||||||||
SDRAM Package Type | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | ||||||||
Maximum Activate Count (MAC) | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | ||||||||
Post Package Repair Supported | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||
Module Type | RDIMM | RDIMM | RDIMM | RDIMM | RDIMM | RDIMM | RDIMM | RDIMM | ||||||||
Module Height (mm) | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | ||||||||
Module Thickness (front), (mm) | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | ||||||||
Module Thickness (back), (mm) | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | ||||||||
Reference Raw Card Used | Raw Card C Rev. 18 | Raw Card C Rev. 18 | Raw Card C Rev. 18 | Raw Card C Rev. 18 | Raw Card C Rev. 18 | Raw Card C Rev. 18 | Raw Card C Rev. 18 | Raw Card C Rev. 18 | ||||||||
# of DRAM Rows | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | ||||||||
# of Registers | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | ||||||||
Heat Spreader Solution Present | No | No | No | No | No | No | No | No | ||||||||
Register Manufacturer | Montage Technology Group | Montage Technology Group | Montage Technology Group | Montage Technology Group | Montage Technology Group | Montage Technology Group | Montage Technology Group | Montage Technology Group | ||||||||
Register Revision | C0 | C0 | C0 | C0 | C0 | C0 | C0 | C0 | ||||||||
Chip Select Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||||||
Command/Address Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||||||
ODT Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||||||
CKE Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||||||
Y0,Y2 Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | ||||||||
Y1,Y3 Drive Strength | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive | Moderate Drive |
03-20-2022 06:46 PM
you cannot mix single rank with dual rank in the same memory bank/channel (each bank nust be all single or dual rank)
the z840 has four memory channels per CPU (if dual cpu's you have 8 channels)
the dimm slot order for cpu 1 should mirrored cpu 2
example: channel 1 must be all single rank dimms
channel 2 must be all dual rank dimms
channel 2 must be all dual rank dimms
channel 4 must be all single rank dimms
To realize full performance at least 1 DIMM must be inserted into each channel, this enables max membandwidth
You cannot intermix LR DIMMs with Registered DIMMs
Types of memory supported on an HP Z840 are:
• 4 GB, 8 GB, 16 GB, and 32 GB PC4-2400R 2400 MHz DDR4 Registered DIMMs supported on Intel® Broadwell (v4) processors
• 4 GB, 8 GB, and 16 GB PC4-2133R MHz DDR4 Registered DIMMs supported on Intel® Haswell (v3) processors
• 64 GB and 128 GB PC4-2400 2400 MHz DDR4 LR DIMMs supported on Intel® Broadwell (v4) processors
• 32 GB, 64 GB, and 128 GB PC4-2133R 2133 MHz LR DIMMs supported on Intel® Haswell (v3) processors
• Single and dual rank 4 GB and 8 GB based DIMMs are supported
• Quad and octal rank 4 GB and 8 GB based LR DIMMs are supported
Types of memory NOT supported on an HP Z840 are:
• Unbuffered DIMMs
• Non-ECC DIMMs
• DDR, DDR2, or DDR3 DIMMs
https://zworkstations.com/site/assets/files/1044/hp-z840-technical-white-paper.pdf
03-28-2022 09:40 AM - edited 03-28-2022 09:44 AM
Thanks for your reply.
I ordered eight sticks of single rank 16gb memory. The installation went without issue and the system booted up first time and saw all the memory.
I have encountered another issue which doesn't make sense. Windows sees all 192gb installed in three channel configurations (as the whitepaper indicates) but the HP Support Assistant only recognizes the 128gb in dual channel (first eight slots) and reports only eight banks of ram. HP Support Assistant is the latest and greatest version. I am not too bothered because Windows install see's all the ram installed, I just worry there is some problem lurking silently waiting for the day the system tries to use those upper memory slots not being recognized.
03-29-2022 10:40 AM - edited 03-29-2022 10:45 AM
if a single cpu, using 16GB dimms slots 1/2/3 (skip 4/5) 6/7/8 should be filled which = 192GB total
if a dual cpu, then use 1/3/6/8 for the first cpu, and 1/3/6/8 for the sec cpu
for dual cpu's the memory slot order MUST BE THE SAME between cpu's
your current config is not correct as it appears the first cpu has more ram slots used
please refer to the HP z820/840 memory load order directions
your z840 has 8 dimm slots per CPU IE- dual cpu's will have 16 dimm slots (8 per cpu)
read the HP white paper link below for proper ram load order (page 23 - 25)
https://zworkstations.com/site/assets/files/1044/hp-z840-technical-white-paper.pdf
Loading rules
• Load the memory modules in order of size, starting with the largest module and finishing with
the smallest module.
• Each channel includes two DIMM sockets; black and white connector pairs represent a channel.
For a single processor configuration, the DIMMs should be loaded first in the black sockets and
then in the white sockets. The DIMMs should be loaded starting with the DIMM furthest from the
CPU, with the first DIMM loaded in the bottom most socket and alternating sides of the CPU.
• For a dual processor configuration, follow the loading order above, but alternate between the
2 processors.