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Subject: URGENT: Critical Engineering Flaw in HP Victus 16 Series - TCS40DLR Hall Effect Sensor Overheating

To the HP Engineering and Global Customer Relations Teams,

I am writing this email to formally report and document a severe hardware design flaw in the HP Victus 16 series (specifically models equipped with i5-13500H and RTX 4050, though it affects others), which is causing sudden screen blackouts under heavy load.

After conducting a detailed hardware diagnosis on the motherboard, I have pinpointed the exact cause of this chronic issue. The problem stems from the TMR (Tunnel Magnetoresistance) / Hall Effect sensor used to detect the lid closure, which is the Toshiba TCS40DLR.

According to the official Toshiba datasheet for the TCS40DLR (Reference: https://www.alldatasheet.net/datasheet-pdf/view/1480941/TOSHIBA/TCS40DLR.html), the absolute maximum operating temperature (Topr) for this component is strictly rated at 85°C.

However, your engineering team has placed this specific IC in one of the hottest thermal zones on the motherboard. When the laptop is under load (such as gaming or rendering), the ambient temperature in this zone easily exceeds the 85°C threshold.

The Technical Failure Mechanism:
As per standard motherboard architecture, the LID_SW signal is maintained at 3.3V via a pull-up resistor. When the lid closes, the TCS40DLR detects the magnetic field and pulls this 3.3V signal down to GND (0V), instructing the Embedded Controller to turn off the display. Because the sensor is constantly exposed to temperatures beyond its maximum operating limit, the IC thermally degrades and malfunctions. The heat causes the sensor to falsely trigger, inappropriately pulling the 3.3V signal to GND without any magnetic field present. This tricks the computer into thinking the lid is closed, abruptly shutting off the screen while the system continues to run in the background.

The Community Impact:
I am not the only one experiencing this. A quick search across global tech forums, Reddit, and your own HP Support Community reveals that countless users are suffering from this exact "black screen under load" issue. Many users are replacing their thermal paste or updating BIOS versions, completely unaware that this is a direct hardware topology flaw.

Despite the widespread nature of this chronic problem, HP has remained completely silent. There has been no official statement, no technical bulletin, and no recall program initiated for this blatant engineering oversight.

Placing a highly temperature-sensitive sensor rated for 85°C right next to high-TDP components in a gaming laptop is an unacceptable design flaw. For my own device, I am forced to physically desolder and remove this IC to bypass the false GND triggers just to use the laptop I paid for.

I urge the HP Hardware Engineering Team to acknowledge this layout error, issue a public technical statement, and provide proper RMA solutions or motherboard revisions for affected customers immediately.

I look forward to a technical explanation regarding this matter.

Sincerely,

[Ahmet Umut Çiftçi]
An electronics enthusiast and deeply disappointed HP customer

1 REPLY 1
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HI @salwador :Thank you for reaching out to the HP Community. I understand your concern and want to ensure it is properly addressed.We take these matters seriously and will help get this resolved. To allow me to investigate and escalate your case to the appropriate team.
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